NHanced Semiconductor adds another exciting technology to its advanced packaging menu: Micro Transfer Printing (MTP). This room-temperature 3D process was developed by X-Celeprint. MTP uses a flexible stamp to transfer tiny dies (chiplets) from a source wafer to a target wafer, positioning them with an accuracy of 1.5 microns (3-sigma, application dependent). Unlike standard pick-and-place technology MTP is massively parallel, transferring hundreds or even thousands of chiplets at once. Its elastomer stamps handle fragile chiplets measuring 20×20 microns, or even smaller, and as thin as 3 microns. A working relationship between NHanced and X-Celeprint provides MTP to our customers, enabling a new level of 3D sophistication.
