NHanced Semiconductors, Inc., is a US-based design and manufacturing innovator with deep expertise in cutting edge semiconductor technologies. Its extensive experience in advanced packaging includes 3D-ICs, silicon interposers, 2.5D, chiplets, additive silicon manufacturing, photonics, microfluidics, and other innovative solutions.
Our development and manufacturing facility (fab) specializes in BEoL and advanced packaging, working with an unusually large variety of materials including III-V compound semiconductors. It currently performs small volume manufacturing, in-house process development, and customer prototyping. The fab is being expanded to house an additional dedicated high-volume production line for advanced packaging.
The company also boasts a seasoned team of design engineers. Their specialized skills in 3D semiconductor design have built a strong customer base. Working under the leadership of 3D pioneer Bob Patti, they extend the functionality of advanced ICs in exciting new directions.