NHanced Semiconductors

The USA’s First Pure-Play Advanced Packaging Foundry

Foundry 2.0 is Here

At NHanced Semiconductors we transform bleeding-edge designs into state-of-the-art 3DICs and 2.5D assemblies. By integrating dies and chiplets from traditional foundries into new and sophisticated combinations, we offer uniquely customized system-level solutions, merging best-of-class components regardless of source, scale, or material. This new manufacturing model empowers breakthrough innovations. We call it Foundry 2.0™.

SERVICESIsn’t It Time to NHance Your Device?

Customers bring us their ideas for advanced devices and specialized sensors. We carry these ideas from prototype to production, serving as a complete supply chain partner.

We collaborate, customize, and control the process — from multi-die/chiplet design to sourcing, advanced packaging, and package assembly.

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MARKETSPurpose-Built for Specialty Markets

We focus on serving the needs of smaller market segments by performing cost-effective high-mix manufacturing at low and medium volumes.

Whether the project is industrial, medical, military, or scientific, we deliver system-level solutions for specialized and unique devices and sensors.

SEE HOW WE ADDRESS SPECIALTY MARKETS

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TECHNOLOGIESBrilliant Concepts Deserve Brilliant Implementation

Many of today’s leading-edge products would benefit by 3D or 2.5D architecture using advanced packaging. From full-fledged 3DICs to smart interposers, from chiplets to photonics to microfluidics, we offer a host of exceptional technologies.

Our deep experience in hybrid bonding and 2.5D and 3D enablement empowers our customers to enhance their products’ performance.

EXPLORE OUR TECHNOLOGIES

ABOUT OUR COMPANYA Firm Foundation

Turning revolutionary ideas into unique devices takes a talented, creative team:

Design engineers who translate brainstorms into brilliant circuitry
Skilled technical experts for layout, P&R, meticulous simulation, and deep verification
Hardcore logic gurus to craft embedded software
Process wizards who transform the design into exquisite, flawless silicon

We are that team.

First we pioneered 3DICs, then we developed proficiency in hybrid bonding, 2.5D, interposers, chiplets, additive semiconductor manufacturing, and more.

Now our U.S.-based facilities provide end-to-end support, from design through packaging and test.

Together, we can create the future.

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