The USA’s First Pure-Play Advanced Packaging Foundry
The USA’s First Pure-Play Advanced Packaging Foundry.
ABOUT OUR COMPANYA Firm Foundation
Turning revolutionary ideas into unique devices takes a talented, creative team:
- Design engineers who translate brainstorms into brilliant circuitry
- Skilled technical experts for layout, P&R, meticulous simulation, and deep verification
- Hardcore logic gurus to craft embedded software
- Process wizards who transform the design into exquisite, flawless silicon
We are that team.
First we pioneered 3DICs, then we developed proficiency in hybrid bonding, 2.5D, interposers, chiplets, additive semiconductor manufacturing, and more.
Now our U.S.-based facilities provide end-to-end support, from design through packaging and test.
Together, we can create the future.
Foundry 2.0 is Here
SERVICESIsn’t It Time to NHance Your Device?
Customers bring us their ideas for advanced devices and specialized sensors. We carry these ideas from prototype to production, serving as a complete supply chain partner.
We collaborate, customize, and control the process — from multi-die/chiplet design to sourcing, advanced packaging, and package assembly.
MARKETSPurpose-Built for Specialty Markets
We focus on serving the needs of smaller market segments by performing cost-effective high-mix manufacturing at low and medium volumes.
Whether the project is industrial, medical, military, or scientific, we deliver system-level solutions for specialized and unique devices and sensors.
TECHNOLOGIESBrilliant Concepts Deserve Brilliant Implementation
Many of today’s leading-edge products would benefit by 3D or 2.5D architecture using advanced packaging. From full-fledged 3DICs to smart interposers, from chiplets to photonics to microfluidics, we offer a host of exceptional technologies.
Our deep experience in hybrid bonding and 2.5D and 3D enablement empowers our customers to enhance their products’ performance.
NEWS & RESOURCES
NHanced Joins the QCi Family (QCi press release)
Hybrid Bonding Everywhere
