Is 2.5D part of Moore’s law? And is Bob Patti a “cool kid”? Yes and yes.
We’ve always known that advanced packaging is cool. Today, Ed Sperling calls it “the best way to handle large amounts of data at blazing speeds.”
Brief, informative, and well-written…
…defined, developed, and beautifully expressed in silicon.
NHanced now has its own semiconductor facility!
DARPA aims for LEGO-like functionality…
Lip-Bu Tan, CEO of Cadence, has interesting things to say about looming disruption in the industry
Advanced packaging extends Moore’s Law by stacking layers of transistors atop one another in 2.5D or 3D assemblies
The computers of tomorrow will be light-years ahead of today’s machines…
Several experts examine the current surge in advanced packaging