MEPTEC sponsored a Known Good Die virtual workshop on Sept 16-18, 2020 featuring presentations by eleven industry experts – including our own Bob Patti. Bob presented Known Not Bad Die Success: Repair, Redundancy, and Pragmatism.
Abstract: Advanced packaging is the obvious path forward to continue the Moore’s Law-like gains that have driven electronics for the last 50 years. To fully realize the benefits of advanced packaging we must drive down interconnect lengths, as they are a primary source of both power consumption and intrinsic delay. Short interconnects lead to tight, intimate assembly. Such assembly is seldom reworkable, and must therefore employ KGD (known good die). The difficulty is that dies are not easy to validate. It is hard even to quantify the definition of “known good.” Can devices be tested at full speed? Can we probe effectively when 10,000s of I/Os are present? In addition, the assembly process itself adds new stresses that can cause latent failures. This talk will discuss repair and redundancy methodologies that overcome yield loss and mitigate the limitations of KGD.