A chiplet is a modular unpackaged integrated circuit (IC) containing a well-defined subset of functionality, designed to be integrated with other components into a finished device.

Originally, integrated circuits (ICs) were single-purpose chips, packaged separately and wired together on circuit boards.

That all changed with the dawn of the SoC – System on a Chip – with multiple functions in a single integrated circuit. This was a huge leap forward in signal speed, system power, and streamlined manufacturing.

Today, advanced packaging ushers in the next wave of innovation: chiplets. Functions are moving back onto separate bits of silicon – chiplets – and integrated on interposers within a package. Short, dense, power-efficient interconnects allow the chiplets to act as a unit.

This new modular approach outperforms the mighty SoC:

• Manufacturing nodes, processes, and materials can be optimized for each specific function
• Smaller dies translate to higher yields
• Each chiplet can be used in multiple system designs
• Customized systems can leave out unnecessary pieces and/or add special functions
• Designs can be upgraded by reworking or swapping out individual chiplets

Chiplets assembled as a 2.5D device

Without advanced packaging, chiplets would be wired together on circuit boards and we’d be back where we started. The power of chiplets is that they can be combined in one package as a 2.5D IC – an advanced package – using microbumps or hybrid bonding with interposers and TSVs. Advanced packaging delivers unmatched in-package interconnect with abundant high-speed paths for signals and power. A chiplet-based system provides all the benefits of an SoC plus greater flexibility, faster design times, and even better performance.

Chiplets before advanced packaging
are just a collection of things…

Chiplets after advanced packaging
become a useful device!

• System would benefit by multiple materials, nodes, or processes
• SoC die would be too big for effective yield
• Product variants or performance tiers are required
• Customizations or upgrades are expected
• Necessary functionalities are already available in chiplet form

• Obtain chiplets and other components from across the industry
• Design custom chiplets and source them for you
• Design and build custom interposers to integrate all the elements
• Use advanced packaging to craft them into excellent new devices

The 3D-IC Ecosystem

Inside the World of Advanced Packaging

Four Reasons Chiplets Will Take Over the World

Chiplets Market Going Big

Chiplets, Cars, and Other Brain Food

Chiplets: Like LEGOs for 2.5D Integration