Advanced Packaging combines separate components so that they act as a single device. The components are typically layered atop one another or on an interposer and tightly integrated. The resulting assembly is encapsulated as if it were a single chip.

Advanced Packaging uses processes and techniques that are typically performed at semiconductor fabrication facilities.

In-package integration enables very short signal paths between the components with high bandwidth and no ESD structures. Devices built this way can achieve:

• Reduced power requirements
• Increased performance
• Smaller footprint
• Faster development cycles
• Improved reliability and security

NHanced Semiconductors, Inc. delivers Advanced Packaging technologies including:

• Heterogeneous Integration
  Components can be built at different nodes, with different materials, on different substrates, using different processes, by different manufacturers. Heterogeneous integration combines “incompatible” components into a sophisticated assembly that behaves as a single circuit.

• Interposers (2.5D)
  An interposer interconnects and adapts multiple components so that they behave as a single circuit (2.5D IC), using less power and delivering higher performance than an equivalent 2D circuit board assembly. We design and build custom interposers, source the necessary components, and perform assembly and test.

• 3D Stacking (3DICs)
  A 3DIC is a single device containing multiple layers of co-designed circuitry interconnected by TSVs (through-silicon vias). 3DICs run at higher speeds and consume less power than any other type of assembly. We process, align, bond, and thin each layer, then perform final packaging and testing.

• Chiplets
  A chiplet is a bare die containing a well-defined subset of functionality, designed to be combined with other chiplets in any number of different applications. We assemble chiplets as components in 2.5D advanced packages. We also design custom chiplets for specialized devices.

• Bonding
  Advanced packaging involves attaching component layers at the wafer-to-wafer, die-to-wafer, or die-to-die level. We employ several bonding technologies including oxide bonding, thermo-compression bonding, and hybrid bonding.

• Micro-Transfer Printing
  Developed by X-Celeprint and licensed by NHanced, Micro-Transfer Printing (MTP) is a massively parallel process that uses a flexible stamp to transfer very small, thin chiplets from the source wafer to a target wafer. It can handle chiplets that are much too small for conventional pick-and-place machines.

• Quilt Packaging
  Developed by Indiana Integrated Circuits, Quilt Packaging (QP) uses special nodules on the edges of chips, chiplets, or substrates. Connecting these nodules “quilts” the components together side-by-side with sub-micron alignment. QP delivers low-power, high-performance advantages much like 2.5D integration without the need for an interposer.

Our class 100 cleanrooms deliver:

• TSVs with ratios up to 10:1, depth to 300 μm
• Hybrid bonding at sub-micron alignment
• Bonded interconnect pitch down to 2 μm
• Interposers with industry-leading 2 μm line/space
• Wafer sizes from 50 mm to 200 mm (300 mm coming soon)
• Bond pad pitch down to 45 μm
• Multi-layer stacks of up to 16 tiers
• Wafer-to-wafer alignment of +/- 1 μm
• Die-to-wafer alignment of +/1 200 nm
• Die sizes from 0.5 x 0.5 mm to 26 x 33 mm
• Low temperature processing at < 170 °C

A laser-sharp focus on Advanced Packaging is the foundation of our Foundry 2.0 business model. Instead of competing against the industry’s big guns, we work with them to create unique, highly specialized semiconductor products.

Talk to us about your project. Let’s explore how NHanced can tailor an Advanced Packaging solution to your precise needs.

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