Isn’t It Time to NHance Your Device?
DESIGN SERVICESIt Starts With an Elegant Concept
We guide products from original concept through schematic, top-level mixed-signal verification, characterization, and qualification, all the way to full production. Our versatile design engineering team has deep experience in cutting-edge technologies and special proficiency in advanced package enablement. With specialties ranging from analog and digital physical designs to low-level system software, their creations have been successfully realized with 2D, 2.5D, and 3D integration.
- Learn about our 2.5D integration technology
- Explore our 3D integration capabilities
- Read about our chiplet services
- See how all this fits into our Foundry 2.0 model
FAB SERVICESSpecializing in Back-End-of-Line
Customers come to us for all their back-end-of-line fab needs — unit processes, modules, and turnkey wafer projects. Our Class 100 cleanrooms are outfitted with full semiconductor processing equipment lines operated by technical specialists who tune and customize processes to meet specific needs.
ADVANCED PACKAGINGLaunch Your Product into the Next Generation
Advanced packaging is the future of semiconductors. We perform all types of advanced packaging including hybrid bonding for 3D and 2.5D devices, assembly of advanced chiplet systems, and integration of heterogeneous materials. We also provide additive silicon manufacturing, photonics, microfluidics, III-V compound semiconductors, and other high-end solutions. Unlike most OSAT providers, NHanced welcomes low- and mid-volume runs of complex devices as well as full production.
3D Hybrid Integration
(one of five awarded for Technology Enablement)
PACKAGE ASSEMBLYComplex Devices in Custom Volumes
Our Foundry 2.0 production environment targets engineering-heavy advanced package assemblies with extremely flexible manufacturing lines that can be tuned for your volume production needs.
Assembling these devices onto substrates or interposers takes special care and skill. We’ve perfected advanced package assembly processes to handle complex devices in any volume, from prototype to full production.
Fully customized silicon sensors are our specialty. We tailor each process step to meet our customers’ precise specifications. We also welcome prototypes, experimental devices, and small lots. Whether the project is industrial, medical, military, or scientific, we are uniquely qualified to deliver expertly crafted sensors.
TESTEnsuring Superior Performance
Testing complex, heterogeneously integrated devices is no easy feat, but our end-to-end supply chain wouldn’t be complete without it.
We use state-of-the-art approaches for thermal cycling, HAST, and probe testing in-house. We also work with outside resources for a broad range of component testing and screening to ensure our customers’ devices achieve the highest yields possible.
