3D Photonic Integration: Enabling Multi-Terabit Operation
NHanced Semiconductors President Robert Patti to
Present an Invited Talk on 3D Photonic Integration
at the 2026 3DIC Conference
In addition to his presentation at the conference, Patti will participate in a panel discussion on “The Self-Sustaining Economics of a Truly Open Chiplet Market.”
ATLANTA (September 14, 2026) – At the upcoming IEEE International 3D Systems Integration Conference (3DIC), Robert Patti, president of NHanced Semiconductors, a QCi company, will deliver an invited presentation titled “3D Photonic Integration: Enabling Multi-Terabit Operation.” The talk will detail the increased implementation of advanced packaging technology for photonics applications.
New packaging technologies have improved device alignment, enabling novel approaches for disaggregation and “chipletization” of microelectronic devices. Also, the growing trend in thin film lithium niobate (TFLN) foundry support for photonics is enabling transceiver operations well beyond 1.6Tb/s. Optical switches and interconnects built with TFLN are highly efficient with low power consumption, and are capable of high bandwidth operations with low insertion losses. Advanced packaging enables heterogeneous integration, as well as the miniaturization and co-location of photonics circuit elements for increased efficiency. Patti’s presentation will discuss the current capabilities and future technology roadmap for advanced packaging in photonics applications.
Patti will also participate in the conference’s panel session: “The Self-Sustaining Economics of a Truly Open Chiplet Market.” Moderated by 3DIC Conference co-chair Paul Franzon (NC State University), the panel includes Patti, Sandeep Kumar Goel (TSMC), Martin Keim (Siemens EDA), and Andreas Olofsson (Zero ASI).
The IEEE International 3D Systems Integration Conference (3DIC) delivers peer-reviewed papers that bring together a technical program for 3D IC researchers and technologists from academia, government, and industry, covering 3D system integration topics including 3D / 2.5D process technology, interposers, chiplets, materials, equipment, circuit technology, design methodology, and applications. Attendees have the opportunity to interact with researchers from all around the world. The conference is sponsored by the IEEE Electronics Packaging Society.
About NHanced Semiconductors, Inc.
NHanced Semiconductors, a QCi company, is the world’s first pure-play advanced packaging foundry, specializing in leading-edge BEoL semiconductor technologies. Its capabilities include chiplets, 3D-ICs, silicon interposers, 2.5D, additive silicon manufacturing, photonics, microfluidics, and other innovative technologies. The foundry works with both standard and non-standard substrates, III‑V compound semiconductors, and many specialized materials.
Headquartered in Illinois, NHanced has a development and manufacturing facility near Research Triangle Park, NC, performing manufacturing, in-house process development, and customer prototyping, as well as a volume interposer and assembly facility in Odon, IN.
About Quantum Computing Inc.
Quantum Computing Inc. (Nasdaq: QUBT) is a vertically integrated quantum company pioneering photonics and semiconductor manufacturing, and delivering accessible, scalable, and cost-effective quantum machines, photonics products, and advanced packaging. The Company provides foundry services for photonic chips and semiconductor manufacturing and offers a vertically integrated portfolio spanning photonics and electronic components, subsystems, and full-stack systems.
Designed to operate at room-temperature with low-power requirements, QCi’s technologies enable practical deployment across high-growth markets, including high-performance computing, artificial intelligence, cybersecurity, aerospace and defense, and advanced sensing and imaging.
Headquartered in Hoboken, New Jersey, QCi also has operations in Arizona, California, Illinois, Indiana, Massachusetts, North Carolina and Virginia. By combining advanced materials, device engineering, and scalable manufacturing, QCi delivers integrated quantum, photonics, and semiconductor technologies, accelerating commercialization and real-world adoption.
