Ultra-Fine Pitch Hybrid Bonding Technology to be Presented at the 2026 IMAPS Symposium by NHanced Semiconductors, University of Florida, & Besi
NHanced’s Charles Woychik, along with equipment supplier Besi and a team from the University of Florida, will highlight the technical challenges facing ultra-fine pitch hybrid bonding in the next generation of heterogeneous integration
BOSTON (September 8, 2026) – At the upcoming 2026 IMAPS Symposium, NHanced Semiconductors Vice President Dr. Charles Woychik and a team lead by Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida, together with semiconductor equipment supplier Besi, will present a paper titled “Technical Challenges for Ultra Fine Pitch Hybrid Bonding.” The paper will describe the key technical barriers to implementing ultra-fine pitch hybrid bonding, as well as the emerging process solutions and equipment innovations that will enable the transition to the ultra-high-density interconnects required for AI and high-performance computing applications.
Hybrid bonding has emerged as a foundational technology for next-generation advanced packaging of semiconductor devices. Applications in AI, advanced memory architectures, photonics, and quantum computing require higher interconnect densities and shorter signal paths than can be provided by traditional packaging approaches such as conventional solder-based technologies. These increasing demands for higher performance, lower power, and increased functionality have been addressed with hybrid bonding that combines direct copper-to-copper connections at extremely fine pitches, enabling near-monolithic integration of chiplets, dies, wafers, and advanced substrates.
Scaling hybrid bonding processes to these ultra-fine pitches presents a range of technical challenges in materials, process integration, equipment capabilities, and reliability concerns. These challenges are made more complex as the industry transitions to heterogeneous integration in advanced systems where logic, memory, photonics, and RF devices are fabricated using dissimilar process technologies and materials. The paper will describe these key challenges and the process innovations required to surmount them, including alignment accuracy, surface preparation, and thermal considerations.
The 2026 IMAPS Symposium will be held at the Encore Boston Harbor Hotel in Boston, MA from September 28 – October 1. Sponsored by the International Microelectronics Assembly & Packaging Society (IMAPS) the Symposium’s theme is “Intelligent Packaging for the AI Era; Heterogeneous Integration and Photonics,” and offers a comprehensive program for microelectronics and advanced packaging content. In addition to the technical program, the IMAPS Symposium includes an exhibition hall, professional development courses, keynote presentations, panel discussions, and networking receptions.
About NHanced Semiconductors, Inc.
NHanced Semiconductors, a QCi company, is the world’s first pure-play advanced packaging foundry, specializing in leading-edge BEoL semiconductor technologies. Its capabilities include chiplets, 3D-ICs, silicon interposers, 2.5D, additive silicon manufacturing, photonics, microfluidics, and other innovative technologies. The foundry works with both standard and non-standard substrates, III‑V compound semiconductors, and many specialized materials.
Headquartered in Illinois, NHanced has a development and manufacturing facility near Research Triangle Park, NC, performing manufacturing, in-house process development, and customer prototyping, as well as a volume interposer and assembly facility in Odon, IN
About Quantum Computing Inc.
Quantum Computing Inc. (Nasdaq: QUBT) is a vertically integrated quantum company pioneering photonics and semiconductor manufacturing and delivering accessible, scalable, and cost-effective quantum machines, photonics products, and advanced packaging. The Company provides foundry services for photonic chips and semiconductor manufacturing and offers a vertically integrated portfolio spanning photonics and electronic components, subsystems, and full-stack systems.
Designed to operate at room-temperature with low-power requirements, QCi’s technologies enable practical deployment across high-growth markets including high-performance computing, artificial intelligence, cybersecurity, aerospace and defense, and advanced sensing and imaging.
Headquartered in Hoboken, New Jersey, QCi also has operations in Arizona, California, Illinois, Indiana, Massachusetts, North Carolina and Virginia. By combining advanced materials, device engineering, and scalable manufacturing, QCi delivers integrated quantum, photonics, and semiconductor technologies, accelerating commercialization and real-world adoption.
About Florida Semiconductor Institute at the University of Florida
The Florida Semiconductor Institute (FSI) serves as a statewide hub at the University of Florida, coordinating R&D, workforce initiatives, and the broader semiconductor ecosystem throughout the state. Florida has the 5th largest semiconductor workforce in the U.S. and aims to catalyze 10,000 new high-wage jobs to further expand opportunities for Floridians and Florida-based businesses.
