Our comprehensive menu of back-end-of-line fab services supports a range of needs from unit processes to wafer turnkey. We are ready to handle any low- to medium-volume manufacturing requirements -- even production of a single wafer.
Silicon thinning
Grinding
CMP
Dry etch
Wet etch, including HNA stop on epi
Bonding methods:
Face-to-face, back-to-back, face-to-back
Wafer-to-wafer (More than three active device wafers per stack)
Die-to-wafer
Die-to-die
Component/chiplet to interposer
Bonding technologies:
Low temperature bonding
Covalent oxide bonding (ZiBond®)
Hybrid Bonding: DBI® (Direct Bond Integration) using copper or nickel