SERVICESFab Services
Our comprehensive menu of back-end-of-line fab services supports a range of needs from unit processes to wafer turnkey. We are ready to handle any low- to medium-volume manufacturing requirements -- even production of a single wafer.
- Silicon thinning
- Grinding
- CMP
- Dry etch
- Wet etch, including HNA stop on epi
- Bonding methods:
- Face-to-face, back-to-back, face-to-back
- Wafer-to-wafer (More than three active device wafers per stack)
- Die-to-wafer
- Die-to-die
- Component/chiplet to interposer
- Bonding technologies:
- Low temperature bonding
- Covalent oxide bonding (ZiBond®)
- DBI® (Direct Bond Integration) using copper or nickel
- Hybrid bonding
- Thermocompression bonding (TCB)
- Temporary bonding/debonding
- Interposers with TSV
- Custom design & build
- Thick layer copper damascene
- Silicon, fused silica, borosilicate glass, and organic substrates
In development: post-fab formable metal with ultra-low CTE - Stitched fields (up to full wafer scale)
- Chiplet integration
- Front side and back side component mount
- Micro-Transfer Printing (MTP)
- Photonics integration
- Microfluidics
- Wafer coring (resizing)
- Surface planarization
- Stress compensation
- Cleaning and deposition
- TSV insertion (back side or via-middle)
- Plasma dicing
- Copper and nickel damascene processes and RDL
- Aluminum RDL and pad metal process
- IR alignment and printing
- Back side passivation / delta doping / antireflective coating (ARC)
- Back side interconnect
- Back side pad open
