News & Resources
We keep our finger on the pulse of the semiconductor and microelectronics industries and then share what we’ve learned. From our latest achievements, technology breakthroughs, and industry insights; it’s all here.
NEWS/PR
NHANCED BLOG
PAPERS & PRESENTATIONS
TERMINOLOGY
- 2.5D: An advanced packaging technology that interconnects components on an interposer within a single packaged device.
… - Chiplet: An unpackaged IC that contains a well-defined subset of functionality, designed to be integrated with other components into a finished device.
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- Foundry 2.0: A manufacturing model that takes building blocks from traditional semiconductor manufacturers and uses advanced packaging and additive manufacturing to create highly customized devices.
… - Heterogeneous Integration: The combining of different types of integrated circuitry in a single device; differences may be in process, node, substrate, source, or function.
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- Through Silicon Via (TSV): A vertical electrical connection that pierces the substrate.
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- W2W: Wafer-to-Wafer (also wafer-on-wafer) stacking: bonding and integrating whole processed wafers atop one another before dicing the stack.
