Sangki Hong, Ph.D. is VP of Operations at our North Carolina facility. He is a first-generation inventor of 3D IC manufacturing, having developed the original processes for both wafer-to-wafer and chip-to-wafer stacking. He currently leads our 3DIC process development team.

Sangki served as Director of Operations at Tezzaron Semiconductor Corporation before joining us at NHanced. Prior to that, he held a variety of engineering management positions at Chartered Semiconductor Manufacturing and Hyundai Semiconductor Corporation.

Throughout his more than 25 years’ experience in world-leading semiconductor companies, Sangki accumulated extensive experience in advanced technology R&D, technology transfer, verification of mass production, and the start-up operation of 3D IC prototype development. He specializes in BEoL module processes and integrated technology and has been awarded more than 12 US patents plus 13 in Korea, 1 in Singapore, and 1 in China. His work has been published in 15 scientific and technical publications. Sangki received a BE degree in Mechanical Engineering from Hongik University, an MSE from the Rochester Institute Technology, and a Ph.D. in Material Science & Engineering from Stevens Institute of Technology.