Sangki Hong, Ph.D. is our Chief Technology Officer. He is a first-generation inventor of 3D IC manufacturing, having developed the original processes for both wafer-to-wafer and chip-to-wafer stacking. He currently leads our advanced packaging process development team.

Sangki served as Director of Operations at Tezzaron Semiconductor Corporation before joining us at NHanced. Prior to that, he held a variety of engineering management positions at Chartered Semiconductor Manufacturing and Hyundai Semiconductor Corporation.

Throughout his more than 25 years’ experience in world-leading semiconductor companies, Sangki accumulated extensive experience in advanced technology R&D, technology transfer, verification of mass production, and the start-up operation of 3D IC prototype development. He specializes in BEoL module processes and integrated technology and has been awarded more than 12 US patents plus 13 in Korea, 1 in Singapore, and 1 in China. His work has been published in 15 scientific and technical publications. Sangki received a BE degree in Mechanical Engineering from Hongik University, an MSE from the Rochester Institute Technology, and a Ph.D. in Material Science & Engineering from Stevens Institute of Technology.