CAREERSIntegration Section Manager
Job Summary
The Integration Section Manager leads a team of integration engineers responsible for defining, developing, and sustaining semiconductor process flows from device concept through high-volume manufacturing. This role ensures that unit processes (lithography, etch, deposition, diffusion, CMP, metrology, etc.) are successfully integrated into robust, manufacturable process flows that meet performance, cost, and schedule targets. The manager acts as a technical leader and people manager, bridging R&D, manufacturing, device, and yield organizations.
Key Responsibilities
Technical Leadership & Process Integration
- Own and drive end-to-end process integration for assigned product platforms
- Define process flow strategies in collaboration with device, module, and design teams
- Lead integration optimization to meet PPA (Power, Performance, Area), yield, reliability, and cost targets
- Identify and resolve cross-module interactions and integration risks
- Support technology transfers from R&D to high-volume manufacturing (HVM)
- Drive root-cause analysis for yield, defectivity, and reliability excursions
Team Leadership & Management
- Lead, mentor, and develop a team of semiconductor integration engineers
- Set clear technical goals, priorities, and success metrics for the team
- Conduct performance reviews, career development planning, and succession planning
- Foster a culture of technical excellence, collaboration, and continuous improvement
- Manage customer relationships, financial milestones, and resources to meet project and manufacturing goals
Cross-Functional Collaboration
- Partner with process module owners (lithography, etch, diffusion, CMP, metals, etc.)
- Collaborate with customers, design, and production teams
- Interface with manufacturing, quality, supply chain, and equipment engineering
- Communicate integration status, risks, and decisions to senior leadership
Strategy & Continuous Improvement
- Contribute to long-term customer needs and scaling strategies
- Drive standardization and best practices across integration methodologies
- Champion innovation in materials, process schemes, and integration approaches
- Ensure rigorous documentation of process assumptions, learnings, and best practices
Required Qualifications
- US citizenship or permanent residency
- Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or related field
- 4–8+ years of experience in semiconductor process integration or related roles
- 1–3+ years of people management or technical leadership experience
- Strong understanding of semiconductor device physics and manufacturing processes.
Preferred Qualifications
- Master’s or PhD in a relevant technical discipline
- Experience with advanced packaging (e.g., Advanced BEOL, 3D integration)
- Background in high-volume manufacturing and technology ramp
- Familiarity with statistical process control (SPC), DOE, and data analytics tools
Key Competencies
- Strong technical judgment and problem-solving skills
- Excellent communication and stakeholder management abilities
- Ability to balance technical depth with execution speed
- Strategic thinking with attention to detail
- Proven ability to lead and motivate diverse, highly technical teams
- Ability to support critical manufacturing or development milestones as needed
Working Conditions
- Cleanroom and office environment
- May require occasional travel to fabs, suppliers, or partner sites
Job Location
Morrisville, North Carolina
More Information
For company description, benefits package, etc. see the Careers Page
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