With staff experience averaging more than 20 years, our seasoned team of design engineers and manufacturing professionals have solid expertise in high-density, low-power products. They work in deep submicron nodes with a keen eye for cost-size-weight reduction and design sustainability. They have created sensors, FPGAs, SerDes, memory chips (DRAM, MRAM, and RRAM), ASICs, AI systems, and many other ingenious devices.

As pioneers in advanced packaging and heterogeneous integration, our team boasts an admirable record of creating successful state-of-the-art products.

Recipients of the 2024 3D InCites Award for Best Place to Work in Microelectronics, we are always looking for dynamic, focused professionals who want to participate in creating the future of electronics.