May 1, 2026 marks the debut of a new online magazine: “Global Advanced Packaging”
The premiere issue features an interview with our own Bob Patti, discussing the rise of advanced packaging and the contribution of our Foundry 2.0 manufacturing model. Advanced Packaging enables reductions in wire length, the use of exotic materials, and the re-use of IP in the form of chiplets. Taken together, these advantages promise lower power budgets, faster design work, more flexibility, and increased customization — all at greatly reduced development cost.
The entire magazine is available here: Global Advanced Packaging May-August 2026
Bob’s article starts on page 18: The Future of Foundry 2.0
