The second IEEE Hybrid Bonding Symposium was held January 2026 in Milpitas, California.
NHanced participated in two sessions, both available via IEEE-TV:
Panel: Enabling Hybrid Bonding Proliferation Chaired by Dongkai Shangguan (Thermal Engineering Associates), with Laura Mirkarimi (Adeia), Alexeev Anton (EVG), Christopher Netzband (TEL), Joeri De Vos (imec), and Robert Patti (NHanced Semiconductor). 45 minutes.
Presentation: Sub 100nm Die-to-Wafer Hybrid Bonding Drives Foundry 2.0 Robert Patti. 38 minutes. Slide set also here.
For more information see also: Hybrid Bonding, Chiplets, Foundry 2.0
