Technical Paper, September 24, 2025
Presented by Chuck Woychik at SMTA International Conference & Exposition in Rosemont, IL.
The transition from monolithic System-on-Chip (SoC) designs to chiplet-based architectures has redefined the landscape of advanced electronics packaging. Central to this shift is the development of high-density, low-latency interconnect technologies that can support multi-chiplet integration within a single package. Among these, hybrid bonding has emerged as a key assembly technique, offering superior electrical, thermal, and mechanical performance.
Hear how Chuck frames the industry shift behind this paper — click for 2-minute video.
(This video provides context. The full technical detail is in the paper below.)
Click to read: The Future of Electronics Packaging is Chiplet Architecture
