Bob Patti on “Foundry 2.0” and the Future of Semiconductors
On the Smart Manufacturing stage at SEMIEXPO Heartland 2025, NHanced President Bob Patti delivered a featured talk: “Foundry 2.0: A New Path for Semiconductors.” He addressed the limits of traditional transistor scaling and outlined how advanced packaging, not smaller nodes, is now driving performance, integration, and innovation across the industry.
He described the Foundry 2.0 model, which brings together chiplet-based architectures, advanced interposers, hybrid bonding, 3D/2.5D interconnect, and fab-level assembly techniques. Bob also shared how NHanced uses the Foundry 2.0 model to deliver flexible, application-specific systems for a wide-ranging spectrum of customers.
Want to learn more about how NHanced is enabling the Foundry 2.0 transition? Visit our Services page.
