Technical Paper, October 22, 2024
Presented by Chuck Woychik at SMTA International 2024 in Rosemont, Illinois.
Silicon interposers with Through-Silicon Vias (TSVs) are essential in advanced packaging for high-density integration, improved electrical performance, and efficient thermal management. This paper explores the technical advantages of using thicker interposers with larger TSVs and discusses design considerations, material choices, manufacturing challenges, and the potential to drive future innovations.
Click to read: The Next Generation of Si-Interposers
