Advanced packaging promises tremendous benefits to almost any design. So why isn’t everybody using it already? As with any new technology, there is a natural wariness; traditional manufacturers may wait to see how it all shakes out. Early adopters are more adventurous, taking some risk to achieve greater potential reward. What will move advanced packaging from the cutting edge to the mainstream? Two important factors are cost and yield, as discussed in these articles from Semiconductor International:
Making 2.5D, Fan-Outs Cheaper
Standards, new materials and different approaches are under development to drive 2.5D, 3DICs and fan-outs into the mainstream.
Advanced Packaging Requires Better Yield
Why the discussion about known good die is suddenly so important again, and how to achieve it.
