Recent articles and reports praise the potential of 3DICs. Click to read three of them:
“The scope for miniaturization is high for 3D IC technology…” (EPS News)
“3D TSVs are essential for heterogeneous integration, HPC, and high-end memory.” (3D InCites)
“Global 3D IC market … worth USD 8.6 Billion by 2020” (A to Z Research)
