TECHNOLOGIESInterposers: Enabling 2.5D
The interposer acts as an electronic intermediary, providing adaptations that allow microelectronic components to interact with an organic substrate. The adaptations are provided by layers of fine, dense wiring designed into the interposer.
Indispensable for 2.5D integration
In today’s semiconductors, interposers are the foundation of 2.5D advanced packaging. Chips, dies, and/or chiplets are mounted side-by-side on an interposer, using any of several types of interconnect. Extremely fine “intimate” interconnect can be achieved with microbumps or hybrid bonding. The components communicate with one another via the interposer, integrated tightly so that they behave as a single circuit. A simplified diagram is shown below.
SWaP advantage
Components on an interposer can be packed much more closely than on an organic substrate. The smaller footprint and micron-scale wiring make the signal path much shorter and more power efficient. In all, 2.5D assembly greatly reduces size, weight, and power requirements.
Heterogeneous integration
The adaptability of interposers enables true heterogeneous integration. Components in the assembly may differ in many ways: pitch, power requirements, material, process node, etc. The interposer accommodates the differences and presents a single interface to the organic substrate.
NHanced interposers
NHanced offers a broader range of interposer options than any other manufacturer.
- Silicon, glass, or fused silica
- Standalone products or complete 2.5D integrated solutions
- Typically assembled with hybrid bonding
- Microbumps, wirebonding, or solder bumping also available
- Standard 2 micron line & space; smaller options available
- Standard interposer thicknesses: 100 µm, 200 µm, 300 µm
- Standard TSVs: 10×100 µm, 25×200 µm, 50×300 µm
- Up to 8 layers of copper wiring (other vendors offer 3 or 4)
- Provides abundant connections
- Supports complex designs
- Photonic interconnect capabilities (not offered by other vendors)
- Stitchless large formats, up to full 200mm wafer size (not offered by other vendors)
- Optional: extra-thick copper layers (not offered by other vendors)
- Higher performance interconnect
- Greater bandwidth
- Better power delivery
- Lower resistance
- Improved signal integrity
- Better signal propagation
- Outperforms monolithic IC wiring
- Optional: extra-thick dielectric layers between wiring layers
- Reduces crosstalk
- Optional: dies mounted on both sides of the interposer
- Up to 8 layers of copper on each side
- Possum-mount connection to circuit board (see below)
