SERVICESDesign Services
Implementing an advanced device in 2.5D or 3D may involve redesigning an existing chip, creating a custom interposer, or inventing a new chiplet from scratch. That’s where our crack design team comes in. With deep experience in high performance low power applications, they move brilliant ideas into elegant, production-ready circuitry.
- Project Management
- System Level Design:
- Artificial intelligence (AI) systems
- Custom algorithms
- Multi-vendor interfaces
- Architectural definitions and specifications
- Software Development:
- Drivers
- Firmware
- Embedded system software
- Operating system customization
- Hardware Front-End Design:
- Analog / RF analog / digital / mixed signal
- Schematic design
- VHDL / Verilog / SystemVerilog coding
- Design synthesis
- Functional verification
- UVM (universal verification methodology)
- Logic simulation
- Formal verification
- Emulation
- Test insertion / test pattern generation
- Physical/Back-End Design:
- 2.5D interposer design
- Floor planning
- Analog / mixed signal layout (custom and auto)
- Place and route
- .lib timing models (analog)
- Timing closure / static timing analysis
- Physical verification
- Formal equivalence checking
- Analog / mixed signal verification
- Signal and power integrity analysis
- Post-layout simulation
- Mask set generation
- Wafer sort, final test, characterization, and QA test program development
- Design of burn-in board
- Load boards, probe cards, socket and package custom tooling
- Product qualification and characterization
- Board bring-up
- Prototype and production
