Isn’t It Time to NHance Your Device?
DESIGN SERVICESIt Starts With an Elegant Concept
We guide products from original concept through schematic, top-level mixed-signal verification, characterization, and qualification, all the way to full production. Our versatile design engineering team has deep experience in cutting-edge technologies and special proficiency in advanced package enablement. With specialties ranging from analog and digital physical designs to low-level system software, their creations have been successfully realized with 2D, 2.5D, and 3D integration.
FAB SERVICESSpecializing in Back-End-of-Line
Customers come to us for all their back-end-of-line fab needs — unit processes, modules, and turnkey wafer projects. Our Class 100 cleanrooms are outfitted with full semiconductor processing equipment lines operated by technical specialists who tune and customize processes to meet specific needs.
ADVANCED PACKAGINGAdvanced Packaging for Specialty Devices
Most outsourced semiconductor assembly and test (OSAT) providers focus on high-volume products. We’re different. We serve customers who need low-volume to medium-volume runs of complex devices. We specialize in advanced packaging and heterogeneous integration, and also provide additive silicon manufacturing, photonics, microfluidics, III-V compound semiconductors, and other high-end solutions.
Semiconductor components can be built at different nodes, on different substrates, using different processes, by different manufacturers. Our technologies can integrate “incompatible” components into a sophisticated assembly that behaves as a single circuit.
An interposer interconnects and adapts multiple components so that they behave as a single circuit (2.5D IC), using less power and delivering higher performance than an equivalent 2D circuit board assembly. We design and build custom interposers, source the necessary components, and perform assembly and test.
A 3DIC is a single device containing multiple layers of co-designed circuitry interconnected by TSVs (through-silicon vias). 3DICs run at higher speeds and consume less power than any other type of assembly. We process, align, bond, and thin each layer, then perform final packaging and testing.
A chiplet is a bare die containing a well-defined subset of functionality, designed to be combined with other chiplets in any number of different applications. We assemble chiplets as components within our advanced packaged devices; we also design custom chiplets.
Advanced packaging involves attaching component layers at the wafer-to-wafer, die-to-wafer, or die-to-die level. We employ several bonding technologies including oxide bonding, thermo-compression bonding, and hybrid bonding.
Developed by X-Celeprint and licensed by NHanced, Micro-Transfer Printing (MTP) is a massively parallel process that uses a flexible stamp to transfer very small, thin chiplets from the source wafer to a target wafer. It can handle chiplets that are much too small for conventional pick-and-place machines.
Developed by Indiana Integrated Circuits, Quilt Packaging uses special nodules on the edges of chips, chiplets, or substrates. Connecting these nodules “quilts” components together side-by-side with sub-micron alignment. Quilt Packaging delivers low-power, high-performance advantages much like 2.5D integration without the need for an interposer.
PACKAGE ASSEMBLYComplex Devices in Custom Volumes
Our Foundry 2.0 production environment targets engineering-heavy advanced package assemblies with extremely flexible manufacturing lines tuned for lower-volume production.
Assembling these devices onto substrates or interposers takes special care and skill. We’ve perfected advanced package assembly processes to handle complex devices in low to medium volumes.
Fully customized silicon sensors are our specialty. We tailor each process step to meet our customers’ precise specifications. We also welcome prototypes, experimental devices, and small lots. Whether the project is industrial, medical, military, or scientific, we are uniquely qualified to deliver expertly crafted sensors.
TESTEnsuring Superior Performance
Testing complex, heterogeneously integrated devices is no easy feat, but our end-to-end supply chain wouldn’t be complete without it.
We use state-of-the-art approaches for thermal cycling, HAST, and probe testing in-house. We also work with outside resources for a broad range of component testing and screening to ensure our customers’ devices achieve the highest yields possible.
