More 3D ICs in the News

Recent articles and reports praise the potential of 3D ICs.  Click to read three of them:

“The scope for miniaturization is high for 3D IC technology…”  (EPS News)

“3D TSVs are essential for heterogeneous integration, HPC, and high-end memory.”  (3D InCites)

“Global 3D IC market … worth USD 8.6 Billion by 2020” (A to Z Research)