Advanced packaging is a powerful enabler for sensors. In fact, the ubiquitous cell phone camera owes its very existence to 3D stacking. NHanced caters to a remarkable spectrum of specialized sensor devices.

For high-resolution back side illuminated photo sensors we perform extreme wafer thinning; for high energy particle sensors we provide ultra-thick silicon substrates. Large-scale focal plane arrays benefit by fully abuttable sensing surfaces. Pressure sensors incorporate unusual piezoelectric materials. We’ve delivered many successful versions of each of these, and we continually refine new technologies to serve the diverse and growing sensor market.