Our Foundry 2.0 business model begins with wafers, dies, and chiplets sourced from traditional high-volume semiconductor foundries.  These sourced building blocks are then enhanced, combined, modified, and implemented using semiconductor fab processes. This may involve:

• Adding wiring and/or photonics
• Depositing new layers of materials
• Building passive RLC components and/or temperature sensors
• Inserting through silicon vias (TSVs)
• Forming memory elements (MRAM, RRAM, etc.)
• Applying thermal enhancement (solid, liquid, or gaseous)
• Creating and implementing custom interposers (glass, fused silica, or silicon)
• Stacking and thinning multiple wafers
• Hybrid bonding of dies, wafers, chiplets

Foundry 2.0 employs BEoL (back end of line) processes that don’t require extreme miniaturization. This means that Foundry 2.0 manufacturing lines can leverage mature technology that is more stable and far less expensive than the equipment that builds leading-edge transistors. Process flows are less rigid; production volumes can be flexible; and costs are much more manageable.

That’s quite an advantage.

Customers start with commodity components or their own custom chips and finish their products at a Foundry 2.0 supplier. This gives them sophisticated, highly differentiated products; best-in-class performance and power reduction; and a tremendous reduction in NRE development costs.

NHanced is the first company to practice Foundry 2.0 at commercial volumes – in fact, we invented the business model and its name. We specialize in advanced packaging and other BEoL processes, including all of the technologies listed earlier.

As a third-party integrator, we don’t build the transistors themselves, so we don’t compete with the leading foundries; we work with them. We can thus offer our customers a full range of heterogeneous integration in their designs.

We deliver successful 3DICs, 2.5D interposer assemblies, and other custom products to government, commercial, mil-aero, and medical entities.

Leverage Foundry 2.0 in your next semiconductor project.