Our Foundry 2.0 manufacturing model begins with dies sourced from traditional high-volume semiconductor foundries. As a third-party integrator, we don’t build the transistors themselves, so we don’t compete with the leading foundries; we work with them.

We combine the sourced building blocks in novel combinations using advanced packaging technologies like through silicon vias (TSVs), hybrid bonding, and glass or silicon interposers.

Customers get the best of both worlds: their leading-edge chips are crafted into sophisticated, highly differentiated, heterogeneously integrated products at the volumes they need, and at 3X reduction in development costs.