Advanced Packaging Goes Mainstream

3D ICs, 2.5D, fan-out, system-in-package, chip stacking, interposers — the industry has long been intrigued by advanced packaging.  The past several years produced a host of predictions, studies, experiments, and a handful of pioneering products.  Have we finally hit the mainstream?  Ed Sperling (of Semiconductor Engineering) says yes.  Read his article here: Advanced Packaging Goes Mainstream