Yole Développement (Yole) has released a new report, “Status of the Advanced Packaging Industry.” It confirms consolidation in the industry and steady revenue growth between 2016 and 2022 at +7%! That CAGR is higher than the total packaging industry, the semiconductor industry, and even the global electronics industry. Yole predicts that advanced packaging will continue to dominate high-end logic and memory in computing and telecom, further penetrate analog and RF in high-end consumer/mobile segments, and pursue the growing automotive and industrial segments. Read more in Solid State Technology: Advanced packaging brings more value and cost reduction to future semiconductor products
(Link to Solid State Technology has been lost)
