3D ASIP 2016 (3D Architectures for Semiconductor Integration and Packaging)

3D ASIP is widely recognized as the premier conference on 2.5D and 3D integrated circuits.  For 13 years, it has drawn a select crowd of advanced packaging experts and pioneers to California’s Bay Area.  This year’s event was covered by Francoise von Trapp in typically exuberant fashion in Hugo Pristauz Drops the F-bomb at 3D ASIP 2016, You Won’t Believe What Happens Next! Although she doesn’t cite the “F-bomb” itself, she quotes several leading lights including our own Bob Patti.