NHanced Wins Award for Significant Advances in 3D Hybrid Bonding
NHanced Semiconductors, Inc. has been recognized for excellence in 3D hybrid bonding technology, winning a 2025 3D InCites Technology Enablement Award. This prestigious award celebrates companies driving semiconductor innovation through cutting-edge solutions in heterogeneous integration, 3D ICs, and chiplet architectures.
Hybrid bonding technology combines covalent oxide bonding with metal-to-metal thermocompression bonding for a rugged, seamless interface. Our winning advancements enable next-generation heterogeneous 3D integration by successfully incorporating diverse materials such as GaN, SiC, and LiNbO3. Through innovative techniques in incremental annealing and material thinning, we also achieve extremely high-density interconnect. These advancements make previously impossible applications a reality, particularly in AI-enabled IR sensors and other cutting-edge devices.
This recognition follows our 2024 3D InCites Best Place to Work Award, demonstrating our commitment to both technological excellence and outstanding workplace culture.
Read more about the 2025 3D InCites awards
