Advanced packaging technologies can achieve 2.5D interposer packages that are thinner than a Euro
The CEO of NHanced Semiconductors discusses Moore’s Law, advanced packaging, chiplets, and Foundry 2.0
By Mark LaPedus
“Chiplets are transforming the market. Moore’s Law is no longer the cost-reduction driver it once was. Instead, customization through chiplets—modular building blocks tailored to specific needs—is enabling more targeted designs.”
“Interposers are a critical focus for us … We foresee a shift from silicon to glass substrates in the next few years. Glass offers better performance and scalability for advanced designs.”
