Company NewsNovember 17, 2020by Editor

Micro-Transfer Printing

NHanced Semiconductor adds another exciting technology to its advanced packaging menu: Micro-Transfer Printing (MTP). This room-temperature 3D process was developed by X-Celeprint. MTP uses a flexible stamp to transfer tiny dies (chiplets) from a source wafer to a target wafer, positioning them with an accuracy of 1.5 microns (3-sigma, application dependent).  Unlike standard pick-and-place technology MTP is massively parallel, transferring hundreds or even thousands of chiplets at once.  Its elastomer stamps handle fragile chiplets measuring 20×20 microns, or even smaller, and as thin as 3 microns.  A working relationship between NHanced and X-Celeprint provides MTP to our customers, enabling a new level of 3D sophistication.

Need more information? Contact us any time.
Need more information? Contact us any time.
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