“Hybrid bonding” generally means any technique that combines metal interconnect with some other form of bonding. The method we employ at NHanced is “direct bond interconnect” technology, or DBI®: room temperature dielectric covalent bonding followed by a higher-temperature anneal to form a metal bond. Long practiced in small-volume production, DBI has become a leading force in advanced packaging.
Phil Garrou gives an excellent in-depth description in his article:
