Every December since 2004, the leaders in 3D integration have assembled in California for several days of intense technical presentations, companionable schmoozing, and spirited one-upmanship. It was 3D-ASIP — the first, original, and (for a few years) only 3D conference anywhere. Its focus was to promote an exciting new technology: 3-dimensional integrated circuits. It attracted chip architects, design engineers, academics, equipment vendors, and other visionaries. The vigorous cross-pollination of ideas and techniques was invaluable for the growing industry. Friendships, rivalries, and business partnerships were born. It was the hotbed of 3D.
And now, 3D is everywhere. Every semiconductor conference worth its salt has presentations about wafer or die stacking, TSVs, heterogeneous integration, SiP, interposers, and 2.5D. The original 3D ideas are simply taken for granted. With no further need for promotion, 3D ASIP has achieved its goals. All of us who participated over the years are sorry to see it end. But those friendships and rivalries endure, fostered at meetings and conferences around the world.
Read more here: RIP 3D-ASIP: 2004 – 2017
