Advanced packaging, in all its various flavors, is really hot news. Together with artificial intelligence (AI) and the internet of things (IoT), advanced packaging technology promises exciting new developments in man-machine interaction. These recent articles are of particular interest:
Packaging Enters New Phase — Ed Sperling
Advanced Packaging Moves To Cars — Ann Steffora Mutschler
MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained — John Lau
Heterogeneous Integration Versus Dimensional Scaling; One Year In: Part 1 and Part 2 — Francoise von Trapp
