Semiconductor Engineering reports on the rise of Advanced Packaging:
“SiP technology is here to stay, and it will find much wider use in semiconductor manufacturing in years to come.”
“It allows more features to be squeezed into ever-smaller form factors, such as wearable gadgets and medical implants.”
Many of NHanced’s favorite technologies — 2.5D, TSVs, heterogeneous integration, integrated passives, etc. — are referenced in their article: Advanced Packaging Picks Up Steam
