Die stacking has come a long way – and it’s still moving onward and upward. An interesting discussion of current trends and trade-offs involved David Pan (U of Texas), Max Min (Samsung), John Hunt (ASE), and Sitaram Arkalgud (Invensas), as reported in Semiconductor Engineering.
“Cost always is a question. But with more functionality and demand for less power, that is defining new areas.”
“…evolving new technologies, not just from a structure or process perspective. That’s going to benefit everyone.”
“…substrate manufacturers are investing a lot of money in new materials, new copper, and things like that to make this work.”
“There is more and more cooperation between design tools…”
Read the entire article here: Stacked Die Changes
