Industry NewsAugust 31, 2016by Editor

The Future of Semiconductor Packaging

What’s next for the semiconductor industry?  Everybody has an opinion, but some are more deeply informed than others.  In a recent Solid State Technology blog post, Phil Garrou says:

“Subramanian Iyer, ex IBM fellow, retired from IBM when the chip business was sold off to Global Foundries. He is now the Distinguished Chancellor’s Professor in the EE Dept. at UCLA and Director of the Center of Heterogeneous Integration and Performance Scaling (or CHIPS for short). The CHIPS mission is to interpret and implement Moore’s Law to include all aspects of heterogeneous systems and develop architectures, methodologies, designs, components, materials and manufacturable integration schemes that will shrink system footprint and improve power and performance. Let’s look at his concept of for where the industry should be going…”

Read the rest of Phil’s article: Are Silicon Circuit Boards in our Future?

Prof. Iyer’s full paper is also available (for purchase): Heterogeneous Integration for Performance and Scaling

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