The USA’s First Pure-Play Advanced Packaging Foundry
The USA’s First Pure-Play Advanced Packaging Foundry.
Foundry 2.0 is Here
Foundry 2.0 is Here
SERVICESIsn’t It Time to NHance Your Device?
Customers bring us their ideas for advanced devices and specialized sensors. We carry these ideas from start to finish, serving as a complete supply chain partner.
We collaborate, customize, and control the process — from multi-die/chiplet design and prototyping to sourcing, advanced packaging, package assembly, and final test.
MARKETSPurpose-Built for Specialty Markets
We focus on serving the needs of smaller market segments by performing cost-effective high-mix manufacturing at low and medium volumes.
Whether the project is industrial, medical, military, or scientific, we deliver system-level solutions for specialized and unique devices and sensors.
TECHNOLOGIESBrilliant Concepts Deserve Brilliant Implementation
Many of today’s leading-edge products would benefit by 3D or 2.5D architecture using advanced packaging. From full-fledged 3DICs to smart interposers, from chiplets to photonics to microfluidics, we offer a host of exceptional technologies.
Our deep experience in 2.5D and 3D enablement empowers our customers to enhance their products’ performance.
ABOUT OUR COMPANYA Firm Foundation
Turning revolutionary ideas into unique devices takes a talented, creative team:
- Design engineers who translate brainstorms into brilliant circuitry
- Skilled technical experts for layout, P&R, meticulous simulation, and deep verification
- Hardcore logic gurus to craft embedded software
- Process wizards who transform the design into exquisite, flawless silicon
We are that team.
First we pioneered 3DICs, then we developed proficiency in 2.5D, silicon interposers, chiplets, additive semiconductor manufacturing, and more.
Now our U.S.-based facilities provide end-to-end support, from design through packaging and test.
Together, we can create the future.
ABOUT OUR COMPANYA Firm Foundation
Turning revolutionary ideas into unique devices takes a talented, creative team:
- Design engineers who translate brainstorms into brilliant circuitry
- Skilled technical experts for layout, P&R, meticulous simulation, and deep verification
- Hardcore logic gurus to craft embedded software
- Process wizards who transform the design into exquisite, flawless silicon
We are that team.
First we pioneered 3D ICs, then we developed proficiency in 2.5D, silicon interposers, chiplets, additive semiconductor manufacturing, and more.
Now our U.S.-based facilities provide end-to-end support, from design through packaging and test.
Together, we can create the future.
NEWS & RESOURCES
Award for Advances in 3D Hybrid Bonding
Four Reasons Chiplets Will Take Over the World (and why it hasn’t happened yet)
