Customers bring us their ideas for advanced devices and specialized sensors. We carry these ideas from start to finish, serving as a complete supply chain partner.
We collaborate, customize, and control the process — from multi-die design and prototyping to sourcing, advanced packaging, package assembly, and final test.
We focus on serving the needs of smaller market segments by performing cost-effective high-mix manufacturing at low and medium volumes.
Whether the project is industrial, medical, military, or scientific, we deliver system-level solutions for specialized and unique devices and sensors.
Many of today’s leading-edge products would benefit by 3D or 2.5D architecture using advanced packaging. From full-fledged 3DICs to smart interposers, from chiplets to photonics to microfluidics, we offer a host of exceptional technologies.
Our deep experience in 2.5D and 3D enablement empowers our customers to enhance their products’ performance.
Turning revolutionary ideas into unique devices takes a talented, creative team:
We are that team.
First we pioneered 3DICs, then we developed proficiency in 2.5D, silicon interposers, chiplets, additive semiconductor manufacturing, and more.
Now our U.S.-based facilities provide end-to-end support, from design through packaging and test.
Together, we can create the future.
Turning revolutionary ideas into unique devices takes a talented, creative team:
We are that team.
First we pioneered 3D ICs, then we developed proficiency in 2.5D, silicon interposers, chiplets, additive semiconductor manufacturing, and more.
Now our U.S.-based facilities provide end-to-end support, from design through packaging and test.
Together, we can create the future.