NHanced Semiconductors

The USA’s First Pure-Play Advanced Packaging Foundry

NHanced Semiconductors

The USA’s First Pure-Play Advanced Packaging Foundry.

Foundry 2.0 is Here

At NHanced Semiconductors we transform bleeding-edge designs into state-of-the-art 3DICs and 2.5D assemblies. By integrating dies and chiplets from traditional foundries into new and sophisticated combinations, we offer uniquely customized system-level solutions, merging best-of-class components regardless of source, scale, or material. This new manufacturing model empowers breakthrough innovations. We call it Foundry 2.0™.
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Foundry 2.0 is Here

At NHanced Semiconductors we transform bleeding-edge designs into state-of-the-art 3D ICs and 2.5D assemblies. By integrating dies and chiplets from traditional foundries into new and sophisticated combinations, we offer uniquely customized system-level solutions, merging best-of-class components regardless of source, scale, or material. This new manufacturing model empowers breakthrough innovations. We call it Foundry 2.0.
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SERVICESIsn’t It Time to NHance Your Device?

Customers bring us their ideas for advanced devices and specialized sensors. We carry these ideas from start to finish, serving as a complete supply chain partner.

We collaborate, customize, and control the process — from multi-die design and prototyping to sourcing, advanced packaging, package assembly, and final test.

MARKETSPurpose-Built for Specialty Markets

We focus on serving the needs of smaller market segments by performing cost-effective high-mix manufacturing at low and medium volumes.

Whether the project is industrial, medical, military, or scientific, we deliver system-level solutions for specialized and unique devices and sensors.

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TECHNOLOGIESBrilliant Concepts Deserve Brilliant Implementation

Many of today’s leading-edge products would benefit by 3D or 2.5D architecture using advanced packaging. From full-fledged 3DICs to smart interposers, from chiplets to photonics to microfluidics, we offer a host of exceptional technologies.

Our deep experience in 2.5D and 3D enablement empowers our customers  to enhance their products’ performance.

ABOUT OUR COMPANYA Firm Foundation

Turning revolutionary ideas into unique devices takes a talented, creative team:

  • Design engineers who translate brainstorms into brilliant circuitry
  • Skilled technical experts for layout, P&R, meticulous simulation, and deep verification
  • Hardcore logic gurus to craft embedded software
  • Process wizards who transform the design into exquisite, flawless silicon

We are that team.

First we pioneered 3DICs, then we developed proficiency in 2.5D, silicon interposers, chiplets, additive semiconductor manufacturing, and more.

Now our U.S.-based facilities provide end-to-end support, from design through packaging and test.

Together, we can create the future. 

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ABOUT OUR COMPANYA Firm Foundation

Turning revolutionary ideas into unique devices takes a talented, creative team:

  • Design engineers who translate brainstorms into brilliant circuitry
  • Skilled technical experts for layout, P&R, meticulous simulation, and deep verification
  • Hardcore logic gurus to craft embedded software
  • Process wizards who transform the design into exquisite, flawless silicon

We are that team.

First we pioneered 3D ICs, then we developed proficiency in 2.5D, silicon interposers, chiplets, additive semiconductor manufacturing, and more.

Now our U.S.-based facilities provide end-to-end support, from design through packaging and test.

Together, we can create the future. 

NEWS & RESOURCES

Building the Future of Tech: NHanced’s Student Tours
August 28, 2024
Building the Future of Tech: NHanced’s Student Tours
At NHanced we’re passionate about inspiring the next generation of tech innovators. Tours of our manufacturing facility in Odon Indiana, located next to NSWC Crane, offer high school and college students a unique look into advanced semiconductor packaging and the incredible opportunities in this dynamic industry. “We are thrilled to collaborate with local future talent...
Advanced Packaging: The Future of Semiconductors and Microelectronics Integration
April 16, 2024
Advanced Packaging: The Future of Semiconductors and Microelectronics Integration
Today’s circuit designers recognize that advanced packaging is as crucial as the semiconductor itself, dramatically influencing size, functionality, power efficiency, performance, reliability, security, and cost-effectiveness. Cutting-edge advanced packaging solutions, including both 2.5D and 3D packaging architectures, are pivotal in this evolution, including: 2.5D: Organic, glass, silicon, and smart interposers 3D: Wafer-on-wafer, die-on-wafer, and die-on-die These...
NHanced Capabilities
August 1, 2024
NHanced Capabilities
Robert Patti presenting in-house for new employees

 


Also available: a GLOSSARY of Advanced Packaging terms and definitions

 


Need more information? Contact us any time.
Need more information? Contact us any time.
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Phone: +1 331-701-7070
Fax: +1 331-701-7055

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